3OZ铜厚度PCB板-SHENZHEN KINGSUM CIRCUIT TECHNOLOGY CO., LTD

Detailed Product Description

Layer Count:	2 ` 30 Layers	Max Board Size:	600 Mm X 1200 Mm
Base Material For PCB:	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material	Rang Of Finish Baords Thickness:	0.21-7.0mm
Minimum Line Width:	3mil (0.075mm)	Minimum Line Space:	3mil (0.075mm)
Minimum Hole Diameter:	0.10 Mm	Finishing Treatment:	HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, Etc.
Thickness Of Copper:	0.5-14oz (18-490um)	E-Testing:	100% E-Testing (High Voltage Testing); Flying Probe Testing
High Light:	printed circuit board pcb,power supply circuit board

3OZ copper thickness PCB board

1. Features of Camera PCBA

Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009

2. Camera PCBA Technical capability

SMT	Position accuracy:20 um
	Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
	Max. component height::25mm
	Max. PCB size:680×500mm
	Min. PCB size:no limited
	PCB thickness:0.3 to 6mm
	PCB weight:3KG
Wave-Solder	Max. PCB width:450mm
	Min. PCB width: no limited
	Component height:Top 120mm/Bot 15mm
Sweat-Solder	Metal type :part, whole, inlay, sidestep
	Metal material:Copper , Aluminum
	Surface Finish:plating Au, plating sliver , plating Sn
	Air bladder rate:less than20%
Press-fit	Press range:0-50KN
Press-fit	Max. PCB size:800X600mm
Testing	ICT,Probe flying,burn-in,function test,temperature cycling